Apple has introduced something exciting called ‘Fusion Architecture’ with the launch of its M5 Pro and M5 Max chips. This new design features a chiplet arrangement that improves on the older monolithic architecture used in previous models.
Instead of the traditional 2.5D design, where components sit separately on the chip, the M5 Pro and M5 Max use stacked dies. This means components are layered on top of each other, which significantly boosts performance. An Apple employee shared in an interview that this change could bring many advantages.
Anand Shimpi, who previously led Anandtech and now works with Apple in hardware technology, discussed the benefits of this new architecture in a recent conversation with Heise online. He explained that learning from the M2 and M3 Ultra chips allowed Apple to optimize performance with these stacked dies. While we wait for die shots to confirm this, it’s clear these designs could provide a faster and more power-efficient experience.
“We’ve shifted from simply combining two identical chips to designing chips with distinct functions across layers.”
This stacked design resembles 3D packaging, where CPU and GPU components are piled together, speeding up communication between them. However, a downside is the potential for increased heat from the stacked layers. Interestingly, in a recent multi-core test, the M5 Max maintained lower temperatures than its predecessor, the M4 Max.
While Anand Shimpi’s role is noted to focus on platform architecture, some online discussions suggest he may be involved in competitive analysis and optimization instead. So, it’s wise to take the stacked die claims with caution until more information surfaces.
For more insights into this evolving story, check out the original interview on Heise online.
